Product Characters

Crystaline Epoxy Resin has high mobility, low viscosity above the melting point and can be implementation of high filler filling in the semiconductor packaging materials,to achieve low linear expansion coefficient, the purpose of low water absorption.The cured product has excellent heat resistance, water resistance and electrical properties.

Application areas

Applicable to high filling,plastic molding compound, powder coatings and other fields.

Main technical data

Packing and storing

1、Packing : By paper-plastic bags with one plastic bag    inside,25kg/bag.

2、        Storage condition: Kept in dry place and away from sunshine under normal temperature.