Product Characters

It has a dicyclopentadiene alicyclic structure except for benzene ring in molecular structure, with excellent heat resistance, low humidity, low dielectric constant and high adhesion, chemical resistance.The cured resin shows good heat resistance and chemical stability.

Application areas

Applicable to ackaging materials, electronic encapsulation materials, high Tg PCB laminates, adhesives, powder coatings and so on.

Main technical data

Packing and storing

1、Packing : By paper-plastic bags with one plastic bag    inside,25kg/bag.

2、Storage condition : Keep in dry place, away from heat, fire and  light.