Product Characters

The product has a multi-functional reaction group, low melt viscosity, can improve the cross-linking density of epoxy curing system, and improve the glass transition temperature at the same time, make the curing system has a higher strength and hardness, and improve its electrical properties and moisture resistance .

Applicable to ackaging materials, electronic encapsulation materials, high Tg PCB laminates, adhesives, powder coatings and so on.

Application areas

Applicable to manufacture of electronic laminates, rigid laminates, multilayer printed circuit boards, high performance aviation compliant materials, adhesives, powder coatings, molds and so  on.

Main technical data

Packaging and storing

1、Packing
   
   Solid : By paper-plastic bags with one plastic bag inside，25kg/bag ; Liquid : 20kg、200kg by drum.

2、 Storage condition : Keep in dry place,away from heat, fire and  light.